W25Q64CVZEJP
vs
W25Q64BVZEIP
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
WINBOND ELECTRONICS CORP
Package Description
HVSON,
HVSON, SOLCC8,.3
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Samacsys Manufacturer
Winbond
Clock Frequency-Max (fCLK)
80 MHz
80 MHz
JESD-30 Code
R-PDSO-N8
R-PDSO-N8
Length
8 mm
8 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
105 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8MX8
8MX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
HVSON
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
3 V
3 V
Screening Level
AEC-Q100
Seated Height-Max
0.8 mm
0.8 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
6 mm
6 mm
Base Number Matches
1
1
Rohs Code
Part Package Code
SON
Pin Count
8
Data Retention Time-Min
20
Endurance
100000 Write/Erase Cycles
Package Equivalence Code
SOLCC8,.3
Qualification Status
Not Qualified
Serial Bus Type
SPI
Standby Current-Max
0.000005 A
Supply Current-Max
0.018 mA
Type
NOR TYPE
Write Protection
HARDWARE/SOFTWARE
Compare W25Q64CVZEJP with alternatives
Compare W25Q64BVZEIP with alternatives