W25Q64JVTBJQ vs W25Q64FVZPIQ feature comparison

W25Q64JVTBJQ Winbond Electronics Corp

Buy Now Datasheet

W25Q64FVZPIQ Winbond Electronics Corp

Buy Now Datasheet
Part Life Cycle Code Active Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Package Description TBGA, WSON-8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Date Of Intro 2018-04-03
Additional Feature IT ALSO OPERATES AT 2.7V @ 104MHZ
Alternate Memory Width 1 1
Clock Frequency-Max (fCLK) 133 MHz 104 MHz
Data Retention Time-Min 20 20
Endurance 100000 Write/Erase Cycles
JESD-30 Code R-PBGA-B24 R-PDSO-N8
Length 8 mm 6 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 8
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 105 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX8 8MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA HSON
Package Equivalence Code BGA24,5X5,40 SOLCC8,.2
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 3 V
Seated Height-Max 1.2 mm 0.8 mm
Serial Bus Type SPI SPI
Standby Current-Max 0.00005 A 0.00005 A
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL NO LEAD
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM DUAL
Type NOR TYPE
Width 6 mm 5 mm
Write Protection HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches 1 1
Rohs Code Yes
Qualification Status Not Qualified

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Compare W25Q64FVZPIQ with alternatives