W25Q64JVTBJQ vs M25PX64SOVZM3EB feature comparison

W25Q64JVTBJQ Winbond Electronics Corp

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M25PX64SOVZM3EB Micron Technology Inc

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP MICRON TECHNOLOGY INC
Package Description TBGA, 6 X 8 MM, ROHS COMPLIANT, TBGA-24
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Date Of Intro 2018-04-03
Samacsys Manufacturer Winbond
Additional Feature IT ALSO OPERATES AT 2.7V @ 104MHZ
Alternate Memory Width 1
Clock Frequency-Max (fCLK) 133 MHz 75 MHz
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
JESD-30 Code R-PBGA-B24 R-PBGA-B24
Length 8 mm 8 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 105 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX8 8MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA TBGA
Package Equivalence Code BGA24,5X5,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 2.7 V
Seated Height-Max 1.2 mm 1.2 mm
Serial Bus Type SPI
Standby Current-Max 0.00005 A
Supply Current-Max 0.02 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE
Width 6 mm 6 mm
Write Protection HARDWARE/SOFTWARE
Base Number Matches 1 1
Rohs Code Yes

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