W25Q64JVSSIQT vs M25P64-VMF3TPB feature comparison

W25Q64JVSSIQT Winbond Electronics Corp

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M25P64-VMF3TPB Numonyx Memory Solutions

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Rohs Code Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer WINBOND ELECTRONICS CORP NUMONYX
Package Description SOP, SOP,
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Additional Feature ALSO OPERATES WITH 2.7V-3V SUPPLY AT 104MHZ
Alternate Memory Width 1
Clock Frequency-Max (fCLK) 133 MHz 75 MHz
JESD-30 Code S-PDSO-G8 R-PDSO-G16
JESD-609 Code e3
Length 5.28 mm 10.3 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 8 16
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX8 8MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3 V 2.7 V
Seated Height-Max 2.16 mm 2.65 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 5.28 mm 7.5 mm
Base Number Matches 1 2
Part Package Code SOIC
Pin Count 16
Qualification Status Not Qualified
Type NOR TYPE

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Compare M25P64-VMF3TPB with alternatives