W25Q64JVSSIQT
vs
M25PX64SOVZM3EB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
MICRON TECHNOLOGY INC
Package Description
SOP,
6 X 8 MM, ROHS COMPLIANT, TBGA-24
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Additional Feature
ALSO OPERATES WITH 2.7V-3V SUPPLY AT 104MHZ
Alternate Memory Width
1
Clock Frequency-Max (fCLK)
133 MHz
75 MHz
JESD-30 Code
S-PDSO-G8
R-PBGA-B24
JESD-609 Code
e3
Length
5.28 mm
8 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
8
24
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8MX8
8MX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
TBGA
Package Shape
SQUARE
RECTANGULAR
Package Style
SMALL OUTLINE
GRID ARRAY, THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
260
Programming Voltage
3 V
2.7 V
Seated Height-Max
2.16 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
DUAL
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
5.28 mm
6 mm
Base Number Matches
1
1
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