W25Q64FVSSIF
vs
W25Q64JVTBJQ
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
WINBOND ELECTRONICS CORP
WINBOND ELECTRONICS CORP
Package Description
SOIC-8
TBGA,
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Samacsys Manufacturer
Winbond
Winbond
Alternate Memory Width
1
1
Clock Frequency-Max (fCLK)
104 MHz
133 MHz
Data Retention Time-Min
20
20
JESD-30 Code
S-PDSO-G8
R-PBGA-B24
Length
5.28 mm
8 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
24
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8MX8
8MX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
TBGA
Package Equivalence Code
SOP8,.3
BGA24,5X5,40
Package Shape
SQUARE
RECTANGULAR
Package Style
SMALL OUTLINE
GRID ARRAY, THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Seated Height-Max
2.16 mm
1.2 mm
Serial Bus Type
SPI
SPI
Standby Current-Max
0.00005 A
0.00005 A
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
DUAL
BOTTOM
Width
5.28 mm
6 mm
Write Protection
HARDWARE/SOFTWARE
HARDWARE/SOFTWARE
Base Number Matches
1
1
Date Of Intro
2018-04-03
Additional Feature
IT ALSO OPERATES AT 2.7V @ 104MHZ
Endurance
100000 Write/Erase Cycles
Supply Current-Max
0.02 mA
Type
NOR TYPE
Compare W25Q64FVSSIF with alternatives
Compare W25Q64JVTBJQ with alternatives