W25Q128FWEIQ vs F25D128QA-104HIG feature comparison

W25Q128FWEIQ Winbond Electronics Corp

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F25D128QA-104HIG Elite Semiconductor Memory Technology Inc

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Rohs Code Yes
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer WINBOND ELECTRONICS CORP ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC
Package Description HVSON, HVSON,
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Samacsys Manufacturer Winbond
Clock Frequency-Max (fCLK) 104 MHz 104 MHz
JESD-30 Code R-PDSO-N8 R-PDSO-N8
Length 8 mm 6 mm
Memory Density 134217728 bit 134217728 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 16777216 words 16777216 words
Number of Words Code 16000000 16000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 16MX8 16MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVSON HVSON
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 1.8 V 1.8 V
Seated Height-Max 0.8 mm 0.8 mm
Supply Voltage-Max (Vsup) 1.95 V 2 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form NO LEAD NO LEAD
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 6 mm 5 mm
Base Number Matches 1 1
Part Package Code SON
Pin Count 8
Package Equivalence Code SOLCC8,.25
Type NOR TYPE
Write Protection HARDWARE/SOFTWARE

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