W25Q128BVFCP
vs
S25FL128POXMFI010
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
SPANSION INC
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Memory IC Type |
FLASH
|
FLASH
|
Programming Voltage |
3 V
|
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Clock Frequency-Max (fCLK) |
|
104 MHz
|
Data Retention Time-Min |
|
20
|
Endurance |
|
100000 Write/Erase Cycles
|
JESD-30 Code |
|
R-PDSO-G16
|
Memory Density |
|
134217728 bit
|
Memory Width |
|
8
|
Number of Terminals |
|
16
|
Number of Words |
|
16777216 words
|
Number of Words Code |
|
16000000
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
|
16MX8
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
SOP
|
Package Equivalence Code |
|
SOP16,.4
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE
|
Parallel/Serial |
|
SERIAL
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Serial Bus Type |
|
SPI
|
Standby Current-Max |
|
0.00002 A
|
Supply Current-Max |
|
0.026 mA
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Form |
|
GULL WING
|
Terminal Pitch |
|
1.27 mm
|
Terminal Position |
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
Type |
|
NOR TYPE
|
Write Protection |
|
HARDWARE/SOFTWARE
|
|
|
|
Compare W25Q128BVFCP with alternatives
Compare S25FL128POXMFI010 with alternatives