W24L01B-70LI vs M5M51016BRT-70LT feature comparison

W24L01B-70LI Winbond Electronics Corp

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M5M51016BRT-70LT Mitsubishi Electric

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP MITSUBISHI ELECTRIC CORP
Part Package Code BGA TSOP2
Package Description TFBGA, BGA36(UNSPEC) SOP,
Pin Count 48 44
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 70 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B48 R-PDSO-G44
Length 11 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 44
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA SOP
Package Equivalence Code BGA36(UNSPEC)
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.05 mm
Standby Voltage-Min 1.5 V 2 V
Supply Current-Max 0.04 mA
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 4.5 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount YES YES
Technology CMOS MIXMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL GULL WING
Terminal Pitch 0.75 mm
Terminal Position BOTTOM DUAL
Width 8 mm
Base Number Matches 1 1
Alternate Memory Width 16
Number of Ports 1
Output Enable YES

Compare W24L01B-70LI with alternatives

Compare M5M51016BRT-70LT with alternatives