W24L01B-70LI vs IS62UP6416SL-100BI feature comparison

W24L01B-70LI Winbond Electronics Corp

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IS62UP6416SL-100BI Integrated Silicon Solution Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP INTEGRATED SILICON SOLUTION INC
Part Package Code BGA BGA
Package Description TFBGA, BGA36(UNSPEC) MINI, BGA-48
Pin Count 48 48
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 100 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B48 R-PBGA-B48
Length 11 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 131072 words 65536 words
Number of Words Code 128000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128KX8 64KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA BGA
Package Equivalence Code BGA36(UNSPEC)
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.05 mm
Standby Voltage-Min 1.5 V
Supply Current-Max 0.04 mA
Supply Voltage-Max (Vsup) 3.6 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.75 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
JESD-609 Code e0
Moisture Sensitivity Level 3
Terminal Finish TIN LEAD

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Compare IS62UP6416SL-100BI with alternatives