VSC8664XIC
vs
KSZ8895MQXITR
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
BGA-256
|
FQFP,
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Microsemi Corporation
|
|
| JESD-30 Code |
S-PBGA-B256
|
R-PQFP-G128
|
| Length |
17 mm
|
20 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
256
|
128
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
FQFP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
GRID ARRAY
|
FLATPACK, FINE PITCH
|
| Seated Height-Max |
2 mm
|
3.4 mm
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET SWITCH
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
17 mm
|
14 mm
|
| Base Number Matches |
2
|
2
|
| ECCN Code |
|
EAR99
|
| Date Of Intro |
|
2016-08-12
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
3
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Equivalence Code |
|
QFP128,.68X.91,20
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare VSC8664XIC with alternatives
Compare KSZ8895MQXITR with alternatives