VSC8562XKS-11
vs
BCM53106SIFBG
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
BROADCOM INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
7 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Data Rate |
1000000 Mbps
|
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B212
|
| Length |
17 mm
|
11 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
256
|
212
|
| Number of Transceivers |
2
|
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
|
-45 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
TFBGA
|
| Package Equivalence Code |
BGA256,16X16,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Seated Height-Max |
1.8 mm
|
1.017 mm
|
| Supply Current-Max |
1130 mA
|
|
| Supply Voltage-Nom |
2.5 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
0.65 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
17 mm
|
11 mm
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
TFBGA,
|
| Moisture Sensitivity Level |
|
3
|
| Technology |
|
CMOS
|
|
|
|
Compare VSC8562XKS-11 with alternatives
Compare BCM53106SIFBG with alternatives