VSC8552XKS-05
vs
88E3018-XX-NNC1I000
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MARVELL SEMICONDUCTOR INC
Package Description
BGA,
HVQCCN, LCC64,.35SQ,20
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Microsemi Corporation
JESD-30 Code
S-PBGA-B256
S-XQCC-N64
Length
17 mm
9 mm
Number of Functions
1
1
Number of Terminals
256
64
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
BGA
HVQCCN
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Seated Height-Max
1.8 mm
1 mm
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Telecom IC Type
ETHERNET TRANSCEIVER
ETHERNET TRANSCEIVER
Terminal Form
BALL
NO LEAD
Terminal Pitch
1 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
17 mm
9 mm
Base Number Matches
1
1
Pbfree Code
Number of Transceivers
1
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Equivalence Code
LCC64,.35SQ,20
Qualification Status
Not Qualified
Technology
CMOS
Temperature Grade
INDUSTRIAL
Compare VSC8552XKS-05 with alternatives
Compare 88E3018-XX-NNC1I000 with alternatives