VSC8552XKS-01
vs
VSC8552XKS-02
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Package Description |
BGA-256
|
BGA,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
5A991.B.1
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
| Length |
17 mm
|
17 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Seated Height-Max |
1.8 mm
|
1.8 mm
|
| Supply Voltage-Nom |
1 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Temperature Grade |
OTHER
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
17 mm
|
17 mm
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
Yes
|
| Samacsys Manufacturer |
|
Microsemi Corporation
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare VSC8552XKS-01 with alternatives
Compare VSC8552XKS-02 with alternatives