VSC8479YHQ-01
vs
TJA1100HN
feature comparison
| Part Life Cycle Code |
Transferred
|
Not Recommended
|
| Ihs Manufacturer |
MICROSEMI CORP
|
NXP SEMICONDUCTORS
|
| Package Description |
FCBGA-195
|
HVQFN-36
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Microsemi Corporation
|
|
| JESD-30 Code |
S-PBGA-B195
|
S-PQCC-N36
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
195
|
36
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
Yes
|
| Additional Feature |
|
3.3V NOMINAL SUPPLY ALSO AVAILABLE
|
| Data Rate |
|
100000 Mbps
|
| Length |
|
6 mm
|
| Moisture Sensitivity Level |
|
1
|
| Number of Transceivers |
|
1
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Equivalence Code |
|
LCC36,.24SQ,20
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Screening Level |
|
AEC-Q100
|
| Seated Height-Max |
|
1 mm
|
| Supply Current-Max |
|
27 mA
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Pitch |
|
0.5 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
6 mm
|
|
|
|
Compare VSC8479YHQ-01 with alternatives
Compare TJA1100HN with alternatives