TJA1100HN
vs
BCM5364P
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Not Recommended
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
BROADCOM CORP
Package Description
HVQFN-36
PLASTIC, BGA-400
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
3.3V NOMINAL SUPPLY ALSO AVAILABLE
Data Rate
100000 Mbps
JESD-30 Code
S-PQCC-N36
X-PBGA-B400
Length
6 mm
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
36
400
Number of Transceivers
1
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
BGA
Package Equivalence Code
LCC36,.24SQ,20
Package Shape
SQUARE
UNSPECIFIED
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Screening Level
AEC-Q100
Seated Height-Max
1 mm
Supply Current-Max
27 mA
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Telecom IC Type
ETHERNET TRANSCEIVER
ETHERNET TRANSCEIVER
Temperature Grade
AUTOMOTIVE
Terminal Form
NO LEAD
BALL
Terminal Pitch
0.5 mm
Terminal Position
QUAD
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
6 mm
Base Number Matches
1
1
Part Package Code
BGA
Pin Count
400
Qualification Status
Not Qualified
Compare TJA1100HN with alternatives
Compare BCM5364P with alternatives