VSC8258YMR-01
vs
VSC7421XJQ-02
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
5A002.A.1
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
4 Weeks
|
|
| Data Rate |
10000000 Mbps
|
|
| JESD-30 Code |
S-PBGA-B256
|
S-PQFP-G302
|
| JESD-609 Code |
e1
|
|
| Length |
17 mm
|
24 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
256
|
302
|
| Number of Transceivers |
4
|
|
| Operating Temperature-Max |
110 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
HTFQFP
|
| Package Equivalence Code |
BGA256,16X16,40
|
TQFP302,1SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
| Seated Height-Max |
2.7 mm
|
1.2 mm
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET SWITCH
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
17 mm
|
24 mm
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
HTFQFP, TQFP302,1SQ
|
| Date Of Intro |
|
2019-10-10
|
| Samacsys Manufacturer |
|
Microchip
|
| Supply Current-Max |
|
2.6 mA
|
|
|
|
Compare VSC8258YMR-01 with alternatives
Compare VSC7421XJQ-02 with alternatives