UT699-ZEC
vs
AM3505AZERAC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
COBHAM PLC
TEXAS INSTRUMENTS INC
Package Description
LGA, LGA484,22X22,50
BGA, BGA484,22X22,40
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
28
16
Bit Size
32
16
Boundary Scan
YES
YES
Clock Frequency-Max
66 MHz
26 MHz
External Data Bus Width
32
16
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CBGA-N484
S-PBGA-B484
JESD-609 Code
e4
e1
Length
28.956 mm
23 mm
Low Power Mode
NO
YES
Number of Terminals
484
484
Operating Temperature-Max
105 °C
Operating Temperature-Min
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
LGA
BGA
Package Equivalence Code
LGA484,22X22,50
BGA484,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.2004 mm
2.48 mm
Speed
66 MHz
600 MHz
Supply Current-Max
27 mA
Supply Voltage-Max
2.7 V
1.248 V
Supply Voltage-Min
2.3 V
1.152 V
Supply Voltage-Nom
2.5 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
GOLD
TIN SILVER COPPER
Terminal Form
NO LEAD
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
28.956 mm
23 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
1
1
Pbfree Code
Rohs Code
Part Package Code
BGA
Pin Count
484
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare UT699-ZEC with alternatives
Compare AM3505AZERAC with alternatives