UT699-ZEC
vs
5962F0822802VYC
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
COBHAM PLC
|
AEROFLEX COLORADO SPRINGS
|
| Package Description |
LGA, LGA484,22X22,50
|
LGA,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
28
|
28
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
66 MHz
|
66 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-CBGA-N484
|
S-CBGA-N484
|
| JESD-609 Code |
e4
|
e4
|
| Length |
28.956 mm
|
28.956 mm
|
| Low Power Mode |
NO
|
NO
|
| Number of Terminals |
484
|
484
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
LGA
|
LGA
|
| Package Equivalence Code |
LGA484,22X22,50
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.2004 mm
|
3.2004 mm
|
| Speed |
66 MHz
|
66 MHz
|
| Supply Current-Max |
27 mA
|
|
| Supply Voltage-Max |
2.7 V
|
2.7 V
|
| Supply Voltage-Min |
2.3 V
|
2.3 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
GOLD
|
GOLD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
28.956 mm
|
28.956 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
LGA
|
| Pin Count |
|
484
|
| Screening Level |
|
MIL-PRF-38535 Class V
|
| Total Dose |
|
300k Rad(Si) V
|
|
|
|
Compare UT699-ZEC with alternatives
Compare 5962F0822802VYC with alternatives