USB2513BI-AEZ
vs
CY7C65620-56LFXC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
QFN
QFN
Package Description
6 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, QFN-36
8 X 8 MM, 1 MM HEIGHT, MO-220, QFN-56
Pin Count
36
56
Reach Compliance Code
compliant
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
Bus Compatibility
I2C; SMBUS
Clock Frequency-Max
24 MHz
24 MHz
Data Transfer Rate-Max
0.0125 MBps
External Data Bus Width
JESD-30 Code
S-XQCC-N36
S-XQCC-N56
JESD-609 Code
e3
e3
Length
6 mm
8 mm
Number of Terminals
36
56
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
HVQCCN
HVQCCN
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Seated Height-Max
1 mm
1 mm
Supply Voltage-Max
3.6 V
3.45 V
Supply Voltage-Min
3 V
3.15 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
MATTE TIN
Matte Tin (Sn)
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
6 mm
8 mm
uPs/uCs/Peripheral ICs Type
BUS CONTROLLER, UNIVERSAL SERIAL BUS
BUS CONTROLLER, UNIVERSAL SERIAL BUS
Base Number Matches
4
2
Rohs Code
Moisture Sensitivity Level
3
Package Equivalence Code
LCC56,.31SQ,20
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Supply Current-Max
190 mA
Time@Peak Reflow Temperature-Max (s)
40
Compare USB2513BI-AEZ with alternatives
Compare CY7C65620-56LFXC with alternatives