UPD78042FGF-XXX-3B9
vs
UPD78042FGF-XXX-3B9-A
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NEC ELECTRONICS AMERICA INC
|
NEC ELECTRONICS AMERICA INC
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
14 X 20 MM, PLASTIC, QFP-80
|
14 X 20 MM, PLASTIC, QFP-80
|
| Pin Count |
80
|
80
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| CPU Family |
UPD78K0
|
|
| Clock Frequency-Max |
5 MHz
|
5 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PQFP-G80
|
R-PQFP-G80
|
| Length |
20 mm
|
20 mm
|
| Number of I/O Lines |
68
|
68
|
| Number of Terminals |
80
|
80
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
QFP
|
| Package Equivalence Code |
QFP80,.7X.9,32
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
512
|
|
| ROM (words) |
16384
|
|
| ROM Programmability |
MROM
|
MROM
|
| Seated Height-Max |
3 mm
|
3 mm
|
| Speed |
5 MHz
|
|
| Supply Current-Max |
21.6 mA
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
MOS
|
MOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
14 mm
|
14 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
|
|
|