UPD70270GD-5BD
vs
PR3400-25MQ160M
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
PERFORMANCE SEMICONDUCTOR CORP
|
Part Package Code |
QFP
|
QFP
|
Package Description |
QFP,
|
QFP, QFP160,1.2SQ
|
Pin Count |
160
|
160
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
3A001.A.2.C
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
20
|
32
|
Bit Size |
16
|
32
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
32 MHz
|
25 MHz
|
External Data Bus Width |
8
|
32
|
Format |
FIXED POINT
|
FLOATING POINT
|
Integrated Cache |
NO
|
NO
|
JESD-30 Code |
S-PQFP-G160
|
S-PQFP-G160
|
Length |
28 mm
|
27.65 mm
|
Low Power Mode |
YES
|
NO
|
Number of DMA Channels |
3
|
|
Number of External Interrupts |
7
|
6
|
Number of Serial I/Os |
|
|
Number of Terminals |
160
|
160
|
On Chip Data RAM Width |
|
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
QFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (words) |
0
|
0
|
Seated Height-Max |
4 mm
|
3.85 mm
|
Speed |
16 MHz
|
25 MHz
|
Supply Current-Max |
150 mA
|
1000 mA
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
MOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.64 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
28 mm
|
27.65 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
Additional Feature |
|
5 PIPELINE STAGES
|
JESD-609 Code |
|
e0
|
Package Equivalence Code |
|
QFP160,1.2SQ
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare UPD70270GD-5BD with alternatives
Compare PR3400-25MQ160M with alternatives