UPD44322182F1-A44Y-FQ2
vs
CY7C1381AV25-117AC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NEC ELECTRONICS CORP
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
QFP
Package Description
LBGA,
14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
Pin Count
165
100
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
2.8 ns
7.5 ns
Additional Feature
PIPELINED ARCHITECTURE
JESD-30 Code
R-PBGA-B165
R-PQFP-G100
JESD-609 Code
e0
e0
Length
17 mm
20 mm
Memory Density
37748736 bit
18874368 bit
Memory IC Type
CACHE SRAM
STANDARD SRAM
Memory Width
18
36
Number of Functions
1
1
Number of Terminals
165
100
Number of Words
2097152 words
524288 words
Number of Words Code
2000000
512000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
2MX18
512KX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LQFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.6 mm
Supply Voltage-Max (Vsup)
3.465 V
2.625 V
Supply Voltage-Min (Vsup)
3.135 V
2.375 V
Supply Voltage-Nom (Vsup)
3.3 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.65 mm
Terminal Position
BOTTOM
QUAD
Width
15 mm
14 mm
Base Number Matches
1
1
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
QFP100,.63X.87
Standby Current-Max
0.015 A
Standby Voltage-Min
2.38 V
Supply Current-Max
0.25 mA
Compare UPD44322182F1-A44Y-FQ2 with alternatives
Compare CY7C1381AV25-117AC with alternatives