UPD442012AGY-BC85X-MJH-A vs W26B021T10LE feature comparison

UPD442012AGY-BC85X-MJH-A NEC Electronics Group

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W26B021T10LE Winbond Electronics Corp

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NEC ELECTRONICS CORP WINBOND ELECTRONICS CORP
Part Package Code TSOP1 TSOP1
Package Description TSOP1, TSOP1, TSSOP48,.71,20
Pin Count 48 48
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 85 ns 100 ns
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e3/e6 e3
Length 18 mm 16.4 mm
Memory Density 2097152 bit 2097152 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -20 °C
Organization 128KX16 128KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.2 V 2.2 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish MATTE TIN/TIN BISMUTH MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 10
Width 12 mm 12 mm
Base Number Matches 1 1
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code TSSOP48,.71,20
Standby Voltage-Min 1.5 V
Supply Current-Max 0.02 mA

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