UPD442000AGU-BC85X-9JH-A
vs
WMS128K8-17CMA
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NEC ELECTRONICS CORP
|
MICROSEMI CORP
|
Part Package Code |
TSOP1
|
DIP
|
Package Description |
TSOP1,
|
DIP,
|
Pin Count |
32
|
32
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A991.B.2.A
|
3A001.A.2.C
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
85 ns
|
17 ns
|
JESD-30 Code |
R-PDSO-G32
|
R-CDIP-T32
|
JESD-609 Code |
e6
|
e0
|
Length |
11.8 mm
|
42.2 mm
|
Memory Density |
2097152 bit
|
1048576 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
32
|
Number of Words |
262144 words
|
131072 words
|
Number of Words Code |
256000
|
128000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-25 °C
|
-55 °C
|
Organization |
256KX8
|
128KX8
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
TSOP1
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
5.13 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.2 V
|
4.5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL EXTENDED
|
MILITARY
|
Terminal Finish |
TIN BISMUTH
|
TIN LEAD
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
0.5 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Width |
8 mm
|
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
|
|
|
Compare UPD442000AGU-BC85X-9JH-A with alternatives
Compare WMS128K8-17CMA with alternatives