UPD350DT-I/Q8XVAO
vs
VNC2-32L1B
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD
Package Description
QFN-28
LQFP, QFP32,.35SQ,32
Reach Compliance Code
compliant
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
Bus Compatibility
SPI
External Data Bus Width
JESD-30 Code
S-PQCC-N28
S-PQFP-G32
Length
4 mm
7 mm
Number of Terminals
28
32
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
LQFP
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
FLATPACK, LOW PROFILE
Screening Level
AEC-Q100; TS 16949
Seated Height-Max
0.9 mm
1.6 mm
Supply Voltage-Max
1.98 V
1.98 V
Supply Voltage-Min
1.62 V
1.62 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.4 mm
0.8 mm
Terminal Position
QUAD
QUAD
Width
4 mm
7 mm
uPs/uCs/Peripheral ICs Type
BUS CONTROLLER, UNIVERSAL SERIAL BUS
BUS CONTROLLER, UNIVERSAL SERIAL BUS
Base Number Matches
1
1
Rohs Code
Part Package Code
QFP
Pin Count
32
Samacsys Manufacturer
FTDI Chip
Additional Feature
ALSO REQUIRES AT 3.3 V I/O SUPPLY
Clock Frequency-Max
6 MHz
Data Transfer Rate-Max
1.5 MBps
Package Equivalence Code
QFP32,.35SQ,32
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare UPD350DT-I/Q8XVAO with alternatives
Compare VNC2-32L1B with alternatives