UPD30550AF2-400-NN1
vs
79RV5000200BS272I
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NEC ELECTRONICS CORP
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
BGA,
BGA,
Pin Count
272
272
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
64
64
Bit Size
64
64
Boundary Scan
YES
YES
Clock Frequency-Max
133 MHz
100 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B272
S-PBGA-B272
JESD-609 Code
e1
e0
Length
29 mm
Low Power Mode
YES
YES
Number of Terminals
272
272
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.05 mm
Speed
400 MHz
200 MHz
Supply Voltage-Max
1.7 V
3.465 V
Supply Voltage-Min
1.6 V
3.135 V
Surface Mount
YES
YES
Technology
MOS
CMOS
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
10
Width
29 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Pbfree Code
Rohs Code
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Supply Voltage-Nom
3.3 V
Temperature Grade
INDUSTRIAL
Compare UPD30550AF2-400-NN1 with alternatives
Compare 79RV5000200BS272I with alternatives