79RV5000200BS272I
vs
MPC5200CBV266
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
BGA,
27 X 27 MM, 1.27 MM PITCH, PLASTIC, BGA-272
Pin Count
272
272
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.A.2
5A991
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
64
32
Bit Size
64
32
Boundary Scan
YES
YES
Clock Frequency-Max
100 MHz
35 MHz
External Data Bus Width
64
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B272
S-PBGA-B272
JESD-609 Code
e0
e0
Low Power Mode
YES
YES
Number of Terminals
272
272
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Speed
200 MHz
266 MHz
Supply Voltage-Max
3.465 V
1.58 V
Supply Voltage-Min
3.135 V
1.42 V
Supply Voltage-Nom
3.3 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
1
3
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Length
27 mm
Moisture Sensitivity Level
3
Package Equivalence Code
BGA272,20X20,50
Peak Reflow Temperature (Cel)
240
Seated Height-Max
2.65 mm
Terminal Pitch
1.27 mm
Time@Peak Reflow Temperature-Max (s)
30
Width
27 mm
Compare 79RV5000200BS272I with alternatives
Compare MPC5200CBV266 with alternatives