UPD30500S2-150
vs
SC103335VR400B
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NEC ELECTRONICS CORP
|
NXP SEMICONDUCTORS
|
| Part Package Code |
BGA
|
|
| Package Description |
LBGA,
|
BGA, BGA272,20X20,50
|
| Pin Count |
272
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
5 PIPELINE STAGE
|
|
| Address Bus Width |
64
|
32
|
| Bit Size |
64
|
32
|
| Boundary Scan |
NO
|
YES
|
| Clock Frequency-Max |
75 MHz
|
66 MHz
|
| External Data Bus Width |
64
|
32
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B272
|
S-PBGA-B272
|
| JESD-609 Code |
e0
|
e2
|
| Length |
29 mm
|
27 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
272
|
272
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.7 mm
|
2.65 mm
|
| Speed |
150 MHz
|
400 MHz
|
| Supply Voltage-Max |
3.465 V
|
1.58 V
|
| Supply Voltage-Min |
3.135 V
|
1.42 V
|
| Supply Voltage-Nom |
3.3 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
MOS
|
CMOS
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN SILVER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
29 mm
|
27 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
2
|
| Moisture Sensitivity Level |
|
3
|
| Package Equivalence Code |
|
BGA272,20X20,50
|
| Screening Level |
|
AEC-Q100
|
|
|
|
Compare UPD30500S2-150 with alternatives
Compare SC103335VR400B with alternatives