UPD30500S2-150
vs
MPC5200CVR266B
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NEC ELECTRONICS CORP
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
LBGA,
BGA, BGA272,20X20,50
Pin Count
272
272
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
5 PIPELINE STAGE
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
64
32
Bit Size
64
32
Boundary Scan
NO
YES
Clock Frequency-Max
75 MHz
35 MHz
External Data Bus Width
64
32
Format
FLOATING POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B272
S-PBGA-B272
JESD-609 Code
e0
Length
29 mm
27 mm
Low Power Mode
YES
YES
Number of Terminals
272
272
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
2.65 mm
Speed
150 MHz
266 MHz
Supply Voltage-Max
3.465 V
1.58 V
Supply Voltage-Min
3.135 V
1.42 V
Supply Voltage-Nom
3.3 V
1.5 V
Surface Mount
YES
YES
Technology
MOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
29 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
1
1
Package Equivalence Code
BGA272,20X20,50
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare UPD30500S2-150 with alternatives
Compare MPC5200CVR266B with alternatives