UPD30500RJ-200
vs
79RV5000200G
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NEC ELECTRONICS AMERICA INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Package Description |
48 X 48 MM, CERAMIC, PGA-223
|
PGA, PGA223,18X18
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
64
|
64
|
Bit Size |
64
|
64
|
Boundary Scan |
NO
|
YES
|
Clock Frequency-Max |
100 MHz
|
100 MHz
|
External Data Bus Width |
64
|
64
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-CPGA-P223
|
S-CPGA-P223
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
223
|
223
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
PGA
|
PGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Speed |
200 MHz
|
200 MHz
|
Supply Voltage-Max |
3.465 V
|
3.465 V
|
Supply Voltage-Min |
3.135 V
|
3.135 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
NO
|
NO
|
Technology |
MOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
OTHER
|
Terminal Form |
PIN/PEG
|
PIN/PEG
|
Terminal Position |
PERPENDICULAR
|
PERPENDICULAR
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
3
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
No
|
Part Package Code |
|
PGA
|
Pin Count |
|
223
|
JESD-609 Code |
|
e0
|
Package Equivalence Code |
|
PGA223,18X18
|
Supply Current-Max |
|
1300 mA
|
Terminal Finish |
|
TIN LEAD
|
Terminal Pitch |
|
2.54 mm
|
|
|
|
Compare UPD30500RJ-200 with alternatives
Compare 79RV5000200G with alternatives