UPC2746T-E3
vs
BGA2711,115
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NEC ELECTRONICS CORP
NXP SEMICONDUCTORS
Package Description
MINIMOLD, 6PIN
PLASTIC, UMT6, SC-88, SOT-363, 6 PIN
Reach Compliance Code
unknown
compliant
Additional Feature
HIGH RELIABILITY
Characteristic Impedance
50 Ω
50 Ω
Construction
COMPONENT
COMPONENT
Gain
16 dB
13.9 dB
Input Power-Max (CW)
10 dBm
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
RF/Microwave Device Type
WIDE BAND LOW POWER
WIDE BAND LOW POWER
Base Number Matches
1
1
Rohs Code
Part Package Code
TSSOP
Pin Count
6
Manufacturer Package Code
SOT363
HTS Code
8542.33.00.01
Factory Lead Time
4 Weeks
Samacsys Manufacturer
NXP
JESD-609 Code
e3
Mounting Feature
SURFACE MOUNT
Number of Functions
1
Number of Terminals
6
Operating Frequency-Max
3600 MHz
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
TSSOP6,.08
Power Supplies
5 V
Supply Current-Max
16 mA
Surface Mount
YES
Technology
BIPOLAR
Terminal Finish
Tin (Sn)
Compare UPC2746T-E3 with alternatives
Compare BGA2711,115 with alternatives