UMX4010E
vs
UM4010
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
ROHS COMPLIANT PACKAGE-2
|
|
Pin Count |
2
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
|
Additional Feature |
LOW DISTORTION
|
|
Application |
ATTENUATOR; SWITCHING
|
|
Breakdown Voltage-Min |
1000 V
|
1000 V
|
Configuration |
SINGLE
|
|
Diode Capacitance-Max |
3 pF
|
3 pF
|
Diode Capacitance-Nom |
2.4 pF
|
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Forward Resistance-Max |
0.5 Ω
|
0.5 Ω
|
Diode Res Test Current |
100 mA
|
|
Diode Res Test Frequency |
100 MHz
|
|
Diode Type |
PIN DIODE
|
PIN DIODE
|
Frequency Band |
HIGH FREQUENCY TO S BAND
|
|
JESD-30 Code |
O-LAMW-F2
|
|
Minority Carrier Lifetime-Nom |
10 µs
|
5 µs
|
Number of Elements |
1
|
|
Number of Terminals |
2
|
|
Package Body Material |
GLASS
|
|
Package Shape |
ROUND
|
|
Package Style |
MICROWAVE
|
|
Power Dissipation-Max |
2.5 W
|
12 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reverse Test Voltage |
100 V
|
|
Surface Mount |
YES
|
|
Technology |
POSITIVE-INTRINSIC-NEGATIVE
|
POSITIVE-INTRINSIC-NEGATIVE
|
Terminal Form |
FLAT
|
|
Terminal Position |
AXIAL
|
|
Base Number Matches |
2
|
2
|
JESD-609 Code |
|
e0
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
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