UL631H256SK55 vs UL631H256SK55G1 feature comparison

UL631H256SK55 Cypress Semiconductor

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UL631H256SK55G1 Cypress Semiconductor

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Pbfree Code No Yes
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIMTEK CORP SIMTEK CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP28,.45 SOP,
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
JESD-30 Code R-PDSO-G28 R-PDSO-G28
JESD-609 Code e0 e3
Length 18.1 mm 18.1 mm
Memory Density 262144 bit 262144 bit
Memory IC Type NON-VOLATILE SRAM NON-VOLATILE SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 32KX8 32KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP28,.45
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.54 mm 2.54 mm
Standby Current-Max 0.0007 A
Supply Current-Max 0.032 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 8.75 mm 8.75 mm
Base Number Matches 3 3
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare UL631H256SK55 with alternatives

Compare UL631H256SK55G1 with alternatives