UJA1169TK/FZ
vs
UJA1169TK/F/3Z
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Package Description |
HVSON-20
|
|
Manufacturer Package Code |
SOT1360-1
|
SOT1360-1
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
|
Samacsys Manufacturer |
NXP
|
NXP
|
Interface IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
JESD-30 Code |
R-PDSO-N20
|
|
JESD-609 Code |
e4
|
e4
|
Length |
5.5 mm
|
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
|
Number of Terminals |
20
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
HVSON
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Screening Level |
AEC-Q100
|
|
Seated Height-Max |
1 mm
|
|
Supply Voltage-Max |
28 V
|
|
Supply Voltage-Min |
2.8 V
|
|
Supply Voltage-Nom |
13 V
|
|
Surface Mount |
YES
|
|
Terminal Finish |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
|
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
|
Terminal Form |
NO LEAD
|
|
Terminal Pitch |
0.5 mm
|
|
Terminal Position |
DUAL
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
3.5 mm
|
|
Base Number Matches |
1
|
1
|
|
|
|
Compare UJA1169TK/FZ with alternatives
Compare UJA1169TK/F/3Z with alternatives