UF2840G vs BLF546 feature comparison

UF2840G MACOM

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BLF546 NXP Semiconductors

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer M/A-COM TECHNOLOGY SOLUTIONS INC NXP SEMICONDUCTORS
Package Description FLANGE MOUNT, R-CDFM-F4 CERAMIC PACKAGE-4
Pin Count 4 4
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.75 8541.29.00.75
Samacsys Manufacturer MACOM
Case Connection SOURCE SOURCE
Configuration SINGLE COMMON SOURCE, 2 ELEMENTS
DS Breakdown Voltage-Min 65 V 65 V
Drain Current-Max (ID) 4 A 9 A
FET Technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss) 8 pF
Highest Frequency Band ULTRA HIGH FREQUENCY BAND ULTRA HIGH FREQUENCY BAND
JESD-30 Code R-CDFM-F4 R-CDFM-F4
Number of Elements 1 2
Number of Terminals 4 4
Operating Mode ENHANCEMENT MODE ENHANCEMENT MODE
Operating Temperature-Max 200 °C 200 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT FLANGE MOUNT
Polarity/Channel Type N-CHANNEL N-CHANNEL
Power Dissipation Ambient-Max 116 W 145 W
Power Dissipation-Max (Abs) 116 W
Power Gain-Min (Gp) 10 dB 11 dB
Qualification Status Not Qualified Not Qualified
Surface Mount NO YES
Terminal Form FLAT FLAT
Terminal Position DUAL DUAL
Transistor Application AMPLIFIER AMPLIFIER
Transistor Element Material SILICON SILICON
Base Number Matches 1 3
Pbfree Code Yes
Rohs Code Yes
Additional Feature HIGH RELIABILITY
Drain-source On Resistance-Max 0.6 Ω
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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