UDN2559EBTR-T
vs
L6221A
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ALLEGRO MICROSYSTEMS LLC
|
STMICROELECTRONICS
|
| Part Package Code |
LCC
|
DIP
|
| Package Description |
LEAD FREE, PLASTIC, MS-018AB, LCC-28
|
DIP, DIP16,.3
|
| Pin Count |
28
|
16
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Built-in Protections |
TRANSIENT; OVER CURRENT; THERMAL
|
|
| Driver Number of Bits |
4
|
4
|
| Interface IC Type |
AND GATE BASED PERIPHERAL DRIVER
|
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
|
| JESD-30 Code |
S-PQCC-J28
|
R-PDIP-T16
|
| JESD-609 Code |
e3
|
e3
|
| Length |
11.51 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
4
|
| Number of Terminals |
28
|
16
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-20 °C
|
|
| Output Current Flow Direction |
SINK
|
SINK
|
| Output Current-Max |
0.6 A
|
1.8 A
|
| Output Peak Current Limit-Nom |
1 A
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
DIP
|
| Package Equivalence Code |
LDCC28,.5SQ
|
DIP16,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
5.1 mm
|
| Supply Voltage-Max |
5.25 V
|
5.5 V
|
| Supply Voltage-Min |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
J BEND
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Turn-on Time |
20 µs
|
2 µs
|
| Width |
11.51 mm
|
7.62 mm
|
| Base Number Matches |
1
|
7
|
| Turn-off Time |
|
5 µs
|
|
|
|
Compare UDN2559EBTR-T with alternatives
Compare L6221A with alternatives