UCN5841EP
vs
MIC5841BWM
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ALLEGRO MICROSYSTEMS LLC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
QLCC
|
SOIC
|
| Package Description |
QCCJ, LDCC20,.4SQ
|
SOIC-18
|
| Pin Count |
20
|
18
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Additional Feature |
SPLIT SUPPLY OPERATION POSSIBLE
|
|
| Built-in Protections |
TRANSIENT
|
TRANSIENT
|
| Driver Number of Bits |
8
|
|
| Input Characteristics |
STANDARD
|
|
| Interface IC Type |
SIPO BASED PERIPHERAL DRIVER
|
SIPO BASED PERIPHERAL DRIVER
|
| JESD-30 Code |
S-PQCC-J20
|
R-PDSO-G18
|
| Length |
8.9662 mm
|
11.55 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
18
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-20 °C
|
-40 °C
|
| Output Characteristics |
OPEN-COLLECTOR
|
|
| Output Current Flow Direction |
SINK
|
SINK
|
| Output Current-Max |
0.35 A
|
|
| Output Peak Current Limit-Nom |
0.5 A
|
|
| Output Polarity |
INVERTED
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
SOP
|
| Package Equivalence Code |
LDCC20,.4SQ
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Seated Height-Max |
4.44 mm
|
2.65 mm
|
| Supply Current-Max |
16 mA
|
|
| Supply Voltage-Max |
12 V
|
12 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIMOS
|
BICMOS
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
8.9662 mm
|
7.5 mm
|
| Base Number Matches |
1
|
3
|
| Pbfree Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Terminal Finish |
|
TIN LEAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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