UCN5810AF vs UCQ5810LWF feature comparison

UCN5810AF Allegro MicroSystems LLC

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UCQ5810LWF Allegro MicroSystems LLC

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ALLEGRO MICROSYSTEMS LLC ALLEGRO MICROSYSTEMS LLC
Part Package Code DIP SOIC
Package Description DIP, DIP18,.3 SOP, SOP18,.4
Pin Count 18 18
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Data Input Mode SERIAL SERIAL
Interface IC Type VACUUM FLUORESCENT DISPLAY DRIVER VACUUM FLUORESCENT DISPLAY DRIVER
JESD-30 Code R-PDIP-T18 R-PDSO-G18
JESD-609 Code e0 e0
Length 22.86 mm 11.55 mm
Multiplexed Display Capability NO NO
Number of Functions 1 1
Number of Segments 10 10
Number of Terminals 18 18
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -20 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP18,.3 SOP18,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.33 mm 2.65 mm
Supply Current-Max 2.5 mA 2.5 mA
Supply Voltage-Nom 5 V 5 V
Supply Voltage1-Nom 60 V 60 V
Surface Mount NO YES
Technology BIMOS BIMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.5 mm
fmax-Min 3.3 MHz 3.3 MHz
Base Number Matches 2 4
Supply Voltage-Max 5.3 V
Supply Voltage-Min 3.5 V

Compare UCN5810AF with alternatives

Compare UCQ5810LWF with alternatives