UCN5801LW
vs
UCS5801H883
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ALLEGRO MICROSYSTEMS LLC
|
ALLEGRO MICROSYSTEMS LLC
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
SOIC-24
|
DIP, DIP22,.4
|
| Pin Count |
24
|
22
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Built-in Protections |
TRANSIENT
|
TRANSIENT
|
| Driver Number of Bits |
8
|
8
|
| Interface IC Type |
LATCH BASED PERIPHERAL DRIVER
|
LATCH BASED PERIPHERAL DRIVER
|
| JESD-30 Code |
R-PDSO-G24
|
R-CDIP-T22
|
| JESD-609 Code |
e0
|
|
| Length |
15.4 mm
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
22
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-20 °C
|
-55 °C
|
| Output Current Flow Direction |
SINK
|
SOURCE
|
| Output Current-Max |
0.35 A
|
0.35 A
|
| Output Peak Current Limit-Nom |
0.5 A
|
0.5 A
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP24,.4
|
DIP22,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
5.08 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
BIMOS
|
BIMOS
|
| Temperature Grade |
OTHER
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.5 mm
|
10.16 mm
|
| Base Number Matches |
1
|
1
|
| Screening Level |
|
MIL-STD-883 Class B
|
|
|
|
Compare UCN5801LW with alternatives
Compare UCS5801H883 with alternatives