UCN5801LW
vs
MIC5801BV
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
Ihs Manufacturer |
ALLEGRO MICROSYSTEMS LLC
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
SOIC
|
QLCC
|
Package Description |
SOIC-24
|
PLASTIC, LCC-28
|
Pin Count |
24
|
28
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Built-in Protections |
TRANSIENT
|
TRANSIENT
|
Driver Number of Bits |
8
|
|
Interface IC Type |
LATCH BASED PERIPHERAL DRIVER
|
LATCH BASED PERIPHERAL DRIVER
|
JESD-30 Code |
R-PDSO-G24
|
S-PQCC-J28
|
JESD-609 Code |
e0
|
e0
|
Length |
15.4 mm
|
11.4554 mm
|
Number of Functions |
1
|
8
|
Number of Terminals |
24
|
28
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-20 °C
|
-40 °C
|
Output Current Flow Direction |
SINK
|
SINK
|
Output Current-Max |
0.35 A
|
|
Output Peak Current Limit-Nom |
0.5 A
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
QCCJ
|
Package Equivalence Code |
SOP24,.4
|
LDCC28,.5SQ
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.65 mm
|
4.318 mm
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BIMOS
|
BIMOS
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
QUAD
|
Width |
7.5 mm
|
11.4554 mm
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
No
|
Moisture Sensitivity Level |
|
1
|
|
|
|
Compare UCN5801LW with alternatives
Compare MIC5801BV with alternatives