UCLAMP3301P.TCT
vs
UCLAMP1211T.TCT
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
SEMTECH CORP
|
SEMTECH CORP
|
| Part Package Code |
DFN
|
DFN
|
| Package Description |
R-XBCC-N2
|
1 X 0.60 MM, 0.40 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, CASE SLP1006P2T, 2 PIN
|
| Pin Count |
2
|
2
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Samacsys Manufacturer |
SEMTECH
|
SEMTECH
|
| Additional Feature |
LOW LEAKAGE CURRENT
|
LOW CAPACITANCE
|
| Clamping Voltage-Max |
8 V
|
27 V
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| JESD-30 Code |
R-XBCC-N2
|
R-PBCC-N2
|
| JESD-609 Code |
e4
|
e4
|
| Moisture Sensitivity Level |
1
|
1
|
| Non-rep Peak Rev Power Dis-Max |
40 W
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Polarity |
UNIDIRECTIONAL
|
BIDIRECTIONAL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
3.3 V
|
12 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
AVALANCHE
|
AVALANCHE
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Base Number Matches |
1
|
1
|
| Manufacturer Package Code |
|
CASE SLP1006P2T
|
| Breakdown Voltage-Max |
|
19 V
|
| Breakdown Voltage-Min |
|
13.3 V
|
| Breakdown Voltage-Nom |
|
16 V
|
|
|
|
Compare UCLAMP3301P.TCT with alternatives
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