UCC5614DP
vs
UC5613QP
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SOIC
|
QLCC
|
| Package Description |
GREEN, PLASTIC, MS-012AC, SOIC-16
|
QCCJ, LDCC28,.5SQ
|
| Pin Count |
16
|
28
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Differential Output |
NO
|
NO
|
| Interface IC Type |
SCSI BUS TERMINATOR
|
SCSI BUS TERMINATOR
|
| JESD-30 Code |
R-PDSO-G16
|
S-PQCC-J28
|
| JESD-609 Code |
e4
|
|
| Length |
9.9 mm
|
11.505 mm
|
| Moisture Sensitivity Level |
2
|
|
| Number of Functions |
1
|
1
|
| Number of Signal Lines |
9
|
9
|
| Number of Terminals |
16
|
28
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
QCCJ
|
| Package Equivalence Code |
SOP16,.25
|
LDCC28,.5SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Pull-up Resistance-Nom |
110 Ω
|
110 Ω
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
4.57 mm
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
2.7 V
|
3.8 V
|
| Supply Voltage-Nom |
3.3 V
|
4.75 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
3.9 mm
|
11.505 mm
|
| Base Number Matches |
4
|
2
|
|
|
|
Compare UCC5614DP with alternatives
Compare UC5613QP with alternatives