UBA1707TS/C2 vs U3550BM-AFLG3 feature comparison

UBA1707TS/C2 NXP Semiconductors

Buy Now Datasheet

U3550BM-AFLG3 Atmel Corporation

Buy Now Datasheet
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS ATMEL CORP
Part Package Code SSOP SOIC
Package Description SSOP, SOP,
Pin Count 28 28
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G28 R-PDSO-G28
Length 10.2 mm 17.925 mm
Number of Functions 1 1
Number of Terminals 28 28
Operating Temperature-Max 75 °C 75 °C
Operating Temperature-Min -25 °C -25 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm
Surface Mount YES YES
Technology BICMOS
Telecom IC Type CORDLESS TELEPHONE SUPPORT CIRCUIT CORDLESS TELEPHONE SUPPORT CIRCUIT
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL EXTENDED
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.3 mm 7.4 mm
Base Number Matches 1 3
Supply Voltage-Nom 3.6 V

Compare UBA1707TS/C2 with alternatives

Compare U3550BM-AFLG3 with alternatives