UBA1707T-T vs LXT317PE feature comparison

UBA1707T-T NXP Semiconductors

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LXT317PE Intel Corporation

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS INTEL CORP
Part Package Code SOIC QLCC
Package Description SOP, QCCJ, LDCC28,.5SQ
Pin Count 28 28
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G28 S-PQCC-J28
Length 17.9 mm 11.506 mm
Number of Functions 1 1
Number of Terminals 28 28
Operating Temperature-Max 75 °C 85 °C
Operating Temperature-Min -25 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP QCCJ
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE CHIP CARRIER
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 4.572 mm
Surface Mount YES YES
Technology BICMOS CMOS
Telecom IC Type CORDLESS TELEPHONE SUPPORT CIRCUIT CORDLESS TELEPHONE BASEBAND CIRCUIT
Temperature Grade COMMERCIAL EXTENDED INDUSTRIAL
Terminal Form GULL WING J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL QUAD
Width 7.5 mm 11.506 mm
Base Number Matches 1 4
Rohs Code No
JESD-609 Code e0
Package Equivalence Code LDCC28,.5SQ
Supply Voltage-Nom 5 V
Terminal Finish Tin/Lead (Sn/Pb)

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