UBA1707T-T
vs
LXT317PE
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
INTEL CORP
|
Part Package Code |
SOIC
|
QLCC
|
Package Description |
SOP,
|
QCCJ, LDCC28,.5SQ
|
Pin Count |
28
|
28
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-PDSO-G28
|
S-PQCC-J28
|
Length |
17.9 mm
|
11.506 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
75 °C
|
85 °C
|
Operating Temperature-Min |
-25 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
QCCJ
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.65 mm
|
4.572 mm
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
CMOS
|
Telecom IC Type |
CORDLESS TELEPHONE SUPPORT CIRCUIT
|
CORDLESS TELEPHONE BASEBAND CIRCUIT
|
Temperature Grade |
COMMERCIAL EXTENDED
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
QUAD
|
Width |
7.5 mm
|
11.506 mm
|
Base Number Matches |
1
|
4
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Package Equivalence Code |
|
LDCC28,.5SQ
|
Supply Voltage-Nom |
|
5 V
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare UBA1707T-T with alternatives
Compare LXT317PE with alternatives