LXT317PE
vs
U2785B-MFSY
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
INTEL CORP
|
ATMEL CORP
|
Part Package Code |
QLCC
|
SOIC
|
Package Description |
QCCJ, LDCC28,.5SQ
|
SSOP,
|
Pin Count |
28
|
28
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PQCC-J28
|
R-PDSO-G28
|
JESD-609 Code |
e0
|
e3
|
Length |
11.506 mm
|
9.055 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-25 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
SSOP
|
Package Equivalence Code |
LDCC28,.5SQ
|
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
SMALL OUTLINE, SHRINK PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.572 mm
|
|
Supply Voltage-Nom |
5 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
BIPOLAR
|
Telecom IC Type |
CORDLESS TELEPHONE BASEBAND CIRCUIT
|
CORDLESS TELEPHONE SUPPORT CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
OTHER
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN
|
Terminal Form |
J BEND
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
11.506 mm
|
4.4 mm
|
Base Number Matches |
4
|
1
|
Moisture Sensitivity Level |
|
1
|
Peak Reflow Temperature (Cel) |
|
260
|
|
|
|
Compare LXT317PE with alternatives
Compare U2785B-MFSY with alternatives