UAA2067G
vs
ML5800DM-SB
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
RF MICRO DEVICES INC
|
| Part Package Code |
QFP
|
QFN
|
| Package Description |
LFQFP,
|
HVQCCN, LCC32,.2SQ,20
|
| Pin Count |
32
|
32
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PQFP-G32
|
S-PQCC-N32
|
| Length |
5 mm
|
5 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
85 °C
|
60 °C
|
| Operating Temperature-Min |
-30 °C
|
-10 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
1 mm
|
| Supply Voltage-Nom |
3.6 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
|
| Telecom IC Type |
CORDLESS TELEPHONE SUPPORT CIRCUIT
|
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
|
| Temperature Grade |
OTHER
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
5 mm
|
5 mm
|
| Base Number Matches |
4
|
1
|
| Rohs Code |
|
Yes
|
| JESD-609 Code |
|
e3
|
| Package Equivalence Code |
|
LCC32,.2SQ,20
|
| Supply Current-Max |
|
90 mA
|
| Terminal Finish |
|
Matte Tin (Sn)
|
|
|
|
Compare UAA2067G with alternatives
Compare ML5800DM-SB with alternatives