UAA2067G vs ML2726DH feature comparison

UAA2067G NXP Semiconductors

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ML2726DH Qorvo

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS QORVO INC
Part Package Code QFP
Package Description LFQFP, TQFP, TQFP32,.35SQ,32
Pin Count 32
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G32 S-PQFP-G32
Length 5 mm 7 mm
Number of Functions 1 1
Number of Terminals 32 32
Operating Temperature-Max 85 °C 60 °C
Operating Temperature-Min -30 °C -10 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP TQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, THIN PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.2 mm
Supply Voltage-Nom 3.6 V 3.3 V
Surface Mount YES YES
Technology BICMOS BICMOS
Telecom IC Type CORDLESS TELEPHONE SUPPORT CIRCUIT CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
Temperature Grade OTHER COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.8 mm
Terminal Position QUAD QUAD
Width 5 mm 7 mm
Base Number Matches 4 2
Rohs Code Yes
JESD-609 Code e3
Package Equivalence Code TQFP32,.35SQ,32
Supply Current-Max 0.076 mA
Terminal Finish Matte Tin (Sn)

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