U631H256CD1K45G1 vs DS1230Y-70+ feature comparison

U631H256CD1K45G1 Cypress Semiconductor

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DS1230Y-70+ Maxim Integrated Products

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Pbfree Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SIMTEK CORP MAXIM INTEGRATED PRODUCTS INC
Part Package Code DIP DIP
Package Description DIP, 0.740 INCH, ROHS COMPLIANT, DIP-28
Pin Count 28 28
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8473.30.11.40
Access Time-Max 45 ns 70 ns
JESD-30 Code R-PDIP-T28 R-XDIP-P28
JESD-609 Code e3 e3
Length 37.1 mm 38.227 mm
Memory Density 262144 bit 262144 bit
Memory IC Type NON-VOLATILE SRAM NON-VOLATILE SRAM MODULE
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 32KX8 32KX8
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.1 mm 9.4 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form THROUGH-HOLE PIN/PEG
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm 15.24 mm
Base Number Matches 3 2
Rohs Code Yes
Package Equivalence Code DIP28,.6
Standby Current-Max 0.0006 A
Supply Current-Max 0.085 mA

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