DS1230Y-70+
vs
DS1230AB-70IND
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
ROCHESTER ELECTRONICS LLC
Part Package Code
DIP
MODULE
Package Description
0.740 INCH, ROHS COMPLIANT, DIP-28
0.740 INCH, DIP-28
Pin Count
28
28
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8473.30.11.40
Access Time-Max
70 ns
70 ns
JESD-30 Code
R-XDIP-P28
R-XDMA-P28
JESD-609 Code
e3
e0
Length
38.227 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
NON-VOLATILE SRAM MODULE
NON-VOLATILE SRAM MODULE
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
32KX8
32KX8
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIP
Package Equivalence Code
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
COMMERCIAL
Seated Height-Max
9.4 mm
Standby Current-Max
0.0006 A
Supply Current-Max
0.085 mA
Supply Voltage-Max (Vsup)
5.5 V
5.25 V
Supply Voltage-Min (Vsup)
4.5 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
Base Number Matches
2
2
Moisture Sensitivity Level
NOT SPECIFIED
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare DS1230Y-70+ with alternatives